Zhong Xin Tech-Zhong Xin Tech

< p > in integrated circuit packages < a href = "https://baike.so.com/doc/6030555-6243556.html" "> < / a > electronics the positions of the pyramid is the pyramid spire is the base of the pyramid. There is good reason to say that it is in both positions. From < a href = "https://baike.so.com/doc/459248-486295.html" "> electronic components < / a > (such as a transistor), the density of this Angle IC represents the tip of the electronics. But the IC is also the starting point, the basic building block that makes up most of the electronic systems in our lives. Also, the IC is not only a single silicon chip or basic electronic structure, the types of IC vary (analog circuit, digital circuit, < a href = "https://baike.so.com/doc/3281726-3457170.html" "> < / a > rf circuit, sensor, etc.), As a result, requirements and requirements for encapsulation vary. This paper gives a comprehensive review of IC packaging technology, and introduces the various materials and processes used in the manufacture of these indispensable packaging structures. Integrated circuit packaging must be fully adapted to the needs and development of electronic complete machines. Due to the different functions of various electronic equipment and instruments, the overall structure and assembly requirements are often not the same. Therefore, integrated circuit packaging must be diverse, enough to meet the needs of a variety of machine. Integrated circuit packaging has progressed with the development of integrated circuits. With the continuous development of aerospace, aviation, machinery, light industry, chemical industry and other industries, the machine is also changing towards multi-function, miniaturization direction. In this way, the integration of integrated circuit is required to become higher and higher, and the function is more and more complex. Accordingly, the packaging density of integrated circuit is increasing, the number of leads is increasing, and the volume is smaller and smaller, the weight is lighter and lighter, and the replacement is faster and faster. The rationality and science of packaging structure will directly affect the quality of integrated circuit. So for integrated circuit manufacturers and users, in addition to master all kinds of performance parameters of the integrated circuit and recognition arrangement, lead to the appearance of a variety of packaging size for integrated circuits, tolerance matching, structure features and encapsulation materials knowledge has a system of knowledge and understanding. So that integrated circuit manufacturers do not use improper packaging to reduce the performance of integrated circuits; Also make integrated circuit users in the use of integrated circuit design and assembly, reasonable layout, space occupancy, appropriate selection, reasonable application.